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Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone X / XS / XS Max, Kaisi Stencil Plant for iPhone X Series Electronics Module Carton Size 42cm * 32cm

SKU: 81203574037

4.6
USD11.99 USD46.99

Pay in 4 interest-free payments of $3.00 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Jul 28 - Aug 2

Description

Carton Size 42cm * 32cm * 39cm / 16

HUAWEI P30 Pro

Support Apt-x:No

The temperature adjustment range of the heat press gun: 100-500 degrees Celsius

Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone X / XS / XS Max, Kaisi Stencil Plant for iPhone X Series Electronics Module Carton Size 42cm * 32cm1. Strong magnetic adsorption, simple operation 2. Fast and convenient soldering 3. High temperature resistance and easy heat dissipation 4. Pewter can be planted accurately at mesh position 5. No damage to the motherboard, accurate positionin Specification: Package Weight One Package Weight 0. 11kgs 0. 25lb One Package Size 15cm * 11cm * 3cm 5. 91inch * 4. 33inch * 1. 18inch Qty per Carton 80 Carton Weight 10. 60kgs 23. 37lb Carton Size 46cm * 32cm *

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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